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BGA Inspection System for BGA Soldering

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BGAs are difficult to rework as they require a pretty deep knowledge of the original manufacturing process, knowledge of the chemistries involved in the original manufacturing process, the thermal profiles of the various processes as well as an experienced eye in terms of BGA inspection.

In terms of BGA inspection, while the IPC-A-610 standard indicates that the inspection of BGAs can be confirmed from a process standpoint via x-ray, it is imperative that the tools of visual inspection, endoscopic inspection, and x-ray be used for proper BGA inspection.

Visual BGA inspection on the edge of the BGA package and the geometries of the depiction is very limited and is a function of having access to a periphery of the device. Many times the operator will have to be able to articulate the board underneath the microscope. This also assumes that the edge of the board has not interfered with respect …